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1. general description the bgx7221 device combines a pair of high performance, high linearity down-mixers for use in receivers having a common local oscillator, for instance having main and diversity paths. the device covers the frequency range from 1400 mhz to 2700 mhz. each mixer provides an input 1 db compression point (icp 1db ) above 13 dbm, with an input third-order intercept point (ip3 i ) of 26 dbm. the small-signal noise figure (nf) is at 10 db whereas under large signal blocking condit ions the noise figure is typically 20 db. isolation between mixers is typically 55 db. 2. features and benefits ? 1400 mhz to 2700 mhz frequency operating range ? conversion gain 8 db in the 2 ghz band ? 13 dbm input power at 1 db gain compression point ? 26 dbm input third-order intercept point ? 10 db typical small signal noise figure ? integrated active biasing ? 5 v single supply operation ? independent power-down hardware control pins per mixer ? low bias current in power-down mode ? matched 50 ? single-ended rf and lo input impedance ? esd protection at all pins 3. applications 4. ordering information bgx7221 dual receiver down mixer rev. 3 ? 8 august 2012 product data sheet ? mobile network infrastructure ? microwave and broadband ? rf and if applications ? industrial applications ? communication systems and radars table 1. ordering information type number package name description version BGX7221HN hvqfn36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 ? 6 ? 0.85 mm sot1092-2
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 2 of 20 nxp semiconductors bgx7221 dual receiver down mixer 5. functional diagram each mixer, a and b employs a transformer to convert the single-ended rf input into a differential signal to drive the passive mos mixer. the mos mixer directly drives the if amplifier. its open-collector outputs deliver the differential signal into an external transformer load, referenced to the 5 v supply for maximum signal s wing. each mixer can be independently powered-off by a combination of poff_1 and poff_2 (see ta b l e 3 .) the dual paths allow diversity operation with a common lo path. a transformer at the lo input converts the single-ended rf into a differential signal to drive the lo buffer chain. the plastic package has an under-side heat -sink paddle which serves as a good rf ground. 6. pinning information 6.1 pinning viewing the device from the top (see figure 2 ), the 2 rf input ports are at the left, the common lo input at the right, with if outputs at the top and bottom. multiple power and ground pins allow for independent supply domains to improve isolation between blocks. fig 1. functional block diagram 001aao042 lo_in bgx7221 if_out_n_a if_out_p_a if_out_n_b if_out_p_b rf_a rf_b mixer a mixer b 1 9 33 32 27 14 13
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 3 of 20 nxp semiconductors bgx7221 dual receiver down mixer 6.2 pin description fig 2. pinning diagram 001aao043 bgx7221 transparent top view n.c. rf_gnd_b rf_b n.c. rf_gnd_b v cc(reg) v cc(lo) poff_1 lo_gnd n.c. v cc(lo) poff_2 rf_gnd_a lo_gnd rf_gnd_a lo_gnd lo_in rf_a v cc(rf)(b) n.c. if_gnd_b if_out_p_b if_out_n_b if_gnd_b v cc(if)(b) n.c. n.c. v cc(rf)(a) n.c. if_gnd_a if_out_p_a if_out_n_ a if_gnd_a v cc(if)(a) n.c. n.c. 9 19 8 20 7 21 6 22 5 23 4 24 3 25 2 26 1 27 10 11 12 13 14 15 16 17 18 36 35 34 33 32 31 30 29 28 terminal 1 index area table 2. pin description symbol pin type [1] description rf_a 1 i receiver mixer single-ended rf input; mixer a rf_gnd_a 2 g rf ground; mixer a rf_gnd_a 3 g rf ground; mixer a v cc(lo) 4 p lo power supply lo_gnd 5 g lo ground v cc(lo) 6 p lo power supply rf_gnd_b 7 g rf ground; mixer b rf_gnd_b 8 g rf ground; mixer b rf_b 9 i receiver mixer single-ended rf input; mixer b v cc(rf)(b) 10 p rf mixer power supply; mixer b n.c. 11 - not connected; to be tied to ground if_gnd_b 12 g if ground; mixer b if_out_p_b 13 o symmetrical if positive output signal; mixer b if_out_n_b 14 o symmetrical if negative output signal; mixer b if_gnd_b 15 g if amplifier ground; mixer b v cc(if)(b) 16 p if amplifier power supply; mixer b n.c. 17 - not connected; to be tied to ground n.c. 18 - not connected; to be tied to ground n.c. 19 - not connected; to be tied to ground n.c. 20 - not connected; to be tied to ground
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 4 of 20 nxp semiconductors bgx7221 dual receiver down mixer [1] g: ground; i: input; o: output; p: power. 7. functional description 7.1 power-up control power-up enable pins to allow each mixer to be placed in power-down mode. these pins also enable the dedicated lo buffers for individual signal paths. a common lo input stage remains active whatever the state of the power off control inputs, in order to maintain good lo port matching. the time requ ired to pass between active and inactive states is less than 10 ? s. if the pins are left open or tied to ground, both mixers will be in active state. v cc(reg ) 21 p internal regulator power supply poff_1 22 i logic input to power-off mixer n.c. 23 - not connected; to be tied to ground poff_2 24 i logic input to power-off mixer lo_gnd 25 g lo ground lo_gnd 26 g lo ground lo_in 27 i single-ended local oscillator positive input n.c 28 - not connected; to be tied to ground n.c 29 - not connected; to be tied to ground v cc(if)(a) 30 p if amplifier power supply; mixer a if_gnd_a 31 g if amplif ier mixer; mixer a if_out_n_a 32 o symmetrical if negative output; mixer a if_out_p_a 33 o symmetrical if positive output; mixer a if_gnd_a 34 g if ground; mixer a n.c. 35 - not connected; to be tied to ground v cc(rf)(a) 36 p rf power supply; mixer a exposed paddle - g exposed paddle; must be connected to rf and dc ground table 2. pin description ?continued symbol pin type [1] description table 3. shutdown control mode description function poff_1 poff_2 active mixers a and b active shutdown disabled 0 0 idle mixers a and b off; current supplied to lo buffer shutdown enabled 1 0 main mixer a active; mixer b off partial shutdown 0 1 diversity mixer b active; mixer a off partial shutdown 1 1
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 5 of 20 nxp semiconductors bgx7221 dual receiver down mixer 8. limiting values 9. thermal characteristics [1] defined according to the conditions described in the application note an10998 . 10. static characteristics [1] v cc = 4.75 v to 5.25 v, t mb = ?40 ? c to +85 ? c. table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.3 +5.5 v p i(rf) rf input power continuous - 20 dbm p tot total power dissipation - 2.5 w t mb mounting base temperature ? 40 +85 ?c t j junction temperature - 150 ?c t stg storage temperature ? 65 +150 c v esd electrostatic discharge voltage eia/jesd22-a114 (hbm) -2500 +2500 v eia/jesd22-c101 (fcdm) -650 +650 v table 5. thermal characteristics symbol parameter conditions typ unit r th(j-mb) thermal resistance from junction to mounting base [1] 8 ?c/w table 6. static characteristics z s = z l = 50 ? ; poff _1 = v il and poff _2 = v il (shutdown disabled). typical values at v cc = 5 v. t mb = 25 ? c, unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage 4.75 5.0 5.25 v i cq quiescent collector current if output; per package pin [1] -60-ma shutdown digital input voltage v il low-level input voltage [1] 0- 0.5v v ih high-level input voltage [1] 2- 5v all digital inputs current i il low-level input current [1] -1- ? a i ih high-level input current [1] -50- ? a
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 6 of 20 nxp semiconductors bgx7221 dual receiver down mixer 11. dynamic characteristics table 7. dynamic characteristics typical application values: poff _1 = v il and poff _2 = v il (shutdown disabled); rf and lo ports driven by 50 ? sources; unless otherwise specified. symbol parameter conditions min [1] typ [2] max [1] unit i cc supply current both mixers in active mode f rf = 1400 mhz - 320 370 ma f rf = 1700 mhz - 330 380 ma f rf = 1900 mhz - 340 390 ma f rf = 2700 mhz - 365 420 ma f i(rf) rf input frequency [3] 1400 - 2700 mhz f lo local oscillator frequency sig nal from frequency generator; f if = 100 mhz to 300 mhz [3] 1500 - 2500 mhz p i(lo) local oscillator input power si gnal from frequency generator [3] ? 3- +3 dbm g conv conversion gain at t mb = 25 ? c; f i(rf) = 1400 mhz to 2700 mhz [4] 6.8 8 9.5 db ? g/ ? t gain variation with temperature t mb = ? 40 ? c to +85 ?c - 0.011 - db/ ?c ? g gain deviation f i(rf) = 1400 mhz to 1465 mhz; f lo =1245mhz [4] [5] -0.2- db f i(rf) = 1710 mhz to 1785 mhz; f lo =1550mhz [4] [5] -0.3- db f i(rf) = 1850 mhz to 1910 mhz; f lo =1680mhz [4] [5] -0.25- db f i(rf) = 1920 mhz to 1980 mhz; f lo =1750mhz [4] [5] -0.25- db f i(rf) = 2300 mhz to 2400 mhz; f lo =2150mhz [4] [5] -0.4- db f i(rf) = 2500 mhz to 2570 mhz; f lo =2335mhz [4] [5] -0.25- db f i(rf) = 2570 mhz to 2620 mhz; f lo =2395mhz [4] [5] -0.2- db icp 1db 1 db input compression point [6] 12.5 14 - dbm ip3 i input third-order intercept point f i(rf)1 to f i(rf)2 = 1 mhz; p i(rf) = ? 5dbm per tone [4] 24 25.5 - dbm 2rf-2lo second-order spurious rejection 2 tone inputs at p lo =0dbm; f i(rf) = 2100 mhz; f i(lo) = 1900 mhz; f i(spur) = 2000 mhz ? 54 ? 60 - dbc nf ssb single sideband noise figure f i(rf) = 1400 mhz to 2200 mhz - 10 12 db f i(rf) = 2200 mhz to 2700 mhz - 10.5 12.5 db nf b noise figure under blocking conditions input in-band blocker +8 dbm; ? f o = 100 mhz [7] -20- db ? l(rf)lo local oscillator rf leakage at rf input port - - ? 30 dbm ? l(if)lo local oscillator if leakage at if output port - - ? 30 dbm
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 7 of 20 nxp semiconductors bgx7221 dual receiver down mixer [1] for all minimum and maximum values the conditions are: p i(rf) = ?5 dbm; p i(lo) = 0 dbm; f i(rf) = 1900 mhz; f lo = 1700 mhz; f if = 200 mhz; t mb = ? 40 c to +85 c; v cc = 4.75 v to 5.25 v. unless othe rwise specified in the conditions. [2] for all typical values, the conditions are: p i(rf) = ? 5 dbm; p lo = 0 dbm; f i(rf) = 1900 mhz; f lo = 1700 mhz; f if = 200 mhz; t mb = 25 c; v cc = 5 v. unless otherwise specified in the conditions. [3] operation outside this range is possi ble but parameters are not guaranteed. [4] class a operation. [5] f if is variable. [6] maximum reliable continuous input power applied to the rf or if port of this device is 12 dbm from a 50 ? source. [7] nf b can be improved by 1 db per db as a function of the p i(lo) . ? isol isolation between mixer a and b; p i(rf) = ? 10 dbm; measured at unwanted if port 45 55 - db s11_rf rf input return loss f i(rf) = 1400 mhz to 2700 mhz - 12 - db s11_lo lo input return loss f lo = 1200 mhz to 2500 mhz - 12 - db s22_if if output return loss f if = 100 mhz to 300 mhz - 14 - db table 7. dynamic characteristics ?continued typical application values: poff _1 = v il and poff _2 = v il (shutdown disabled); rf and lo ports driven by 50 ? sources; unless otherwise specified. symbol parameter conditions min [1] typ [2] max [1] unit
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 8 of 20 nxp semiconductors bgx7221 dual receiver down mixer 12. application information figure 3 shows a typical application circuit. both rf and rf reference pins need to be ac coupled. the inputs are internally dc biased in order to provide good esd protection, and to support large input signals without clam ping. the output matching requires a transformer to co pe with the dc at the output. fig 3. application diagram 001aao044 bgx7221 mixer a mixer b 1 2 3 4 5 6 36 18 pf 1 nf 100 nf 150 pf blm18ag102sn1 blm18ag102sn1 v cc(rf)(b) n.c. if_gnd_a if_out_p_a if_out_n_a if_gnd_a v cc(if)(a) n.c. n.c. v cc(rf)(b) n.c. if_gnd_b if_out_p_b if_out_n_b if_gnd_b v cc(if)(b) n.c. n.c. 35 34 33 32 31 30 29 28 10 11 12 13 14 15 16 17 18 7 8 9 rf_a rf_gnd_a rf_gnd_a v cc(lo) v cc v cc v cc v cc v cc lo_gnd v cc(lo) rf_gnd_b rf_gnd_b rf_b 27 26 25 24 23 22 21 20 19 lo_in tc4-1w-g2+ lo_gnd lo_gnd poff_2 n.c. poff_1 v cc(reg) v cc v cc v cc v cc n.c. n.c. s2 s1 15 pf 18 pf 100 nf 150 pf 100 nf 18 pf 150 pf 18 pf 1 nf 100 nf blm18ag102sn1 blm18ag102sn1 tc4-1w-g2+ v cc 15 pf 150 pf
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 9 of 20 nxp semiconductors bgx7221 dual receiver down mixer 13. test information (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. (2) p i(lo) =+3dbm. (3) p i(lo) = ? 3dbm. fig 4. g conv versus f rf and t mb fig 5. g conv versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 6. g conv versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002510 7 8 9 6 conversion gain (db) (3) (2) (1) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002511 7 8 9 6 conversion gain (db) (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002512 7 8 9 6 conversion gain (db) (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 10 of 20 nxp semiconductors bgx7221 dual receiver down mixer (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. (2) p i(lo) =+3dbm. (3) p i(lo) = ? 3dbm. fig 7. ip3 i versus f rf and t mb fig 8. ip3 i versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 9. ip3 i versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002513 iip3 (dbm) 26 25 27 28 24 (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002514 iip3 (dbm) 26 25 27 28 24 (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002515 26 25 27 28 24 iip3 vs rf (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 11 of 20 nxp semiconductors bgx7221 dual receiver down mixer (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. (2) p i(lo) =+3dbm. (3) p i(lo) = ? 3dbm. fig 10. nf versus f rf and t mb fig 11. nf versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 12. nf versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002516 10 11 9 12 13 nf (db) 8 (3) (1) (2) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002517 10 11 9 12 13 nf (db) 8 (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002518 10 11 9 12 13 nf (db) 8 (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 12 of 20 nxp semiconductors bgx7221 dual receiver down mixer (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. (2) p i(lo) =+3dbm. (3) p i(lo) = ? 3dbm. fig 13. icp 1db versus f rf and t mb fig 14. icp 1db versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 15. icp 1db versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002519 14 15 16 13 icp 1db (dbm) (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002520 14 15 16 13 icp 1db (dbm) (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002521 14 15 16 13 icp 1db (dbm) (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 13 of 20 nxp semiconductors bgx7221 dual receiver down mixer (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. (2) p i(lo) =+3dbm. (3) p i(lo) = ? 3dbm. fig 16. 2rf-2lo response versus f rf and t mb fig 17. 2rf-2lo response versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 18. 2rf-2lo response versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002522 80 50 60 70 2rf-2lo (dbc) (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002523 80 50 60 70 2rf-2lo (dbc) (2) (1) (3) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002524 80 50 60 70 2rf-2lo (dbc) (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 14 of 20 nxp semiconductors bgx7221 dual receiver down mixer (1) t mb =+25 ? c. (2) t mb =+85 ? c. (3) t mb = ?40 ? c. (1) p i(lo) =0dbm. fig 19. ? isol versus f rf and t mb fig 20. ? isol versus f rf and p i(lo) (1) v cc =5v. (2) v cc =5.25v. (3) v cc =4.75v. fig 21. ? isol versus f rf and v cc rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002525 70 40 50 60 isol (db) (2) (3) (1) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002526 70 40 50 60 isol (db) (1) rf (mhz) 1400 1800 2200 2600 2800 2400 2000 1600 aaa-002527 70 40 50 60 isol (db) (2) (1) (3)
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 15 of 20 nxp semiconductors bgx7221 dual receiver down mixer 14. package outline fig 22. package outline sot1092-2 (hvqfn36) references outline version european projection issue date iec jedec jeita sot1092-2 - - - - - - sot1092-2_po unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.30 0.21 0.18 0.2 6.1 6.0 5.9 6.1 6.0 5.9 0.5 0.1 0.05 a (1) dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. hvqfn36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm sot1092-2 a 1 bcd (1) 0.1 y 1 d h 4.05 3.90 3.75 e (1) e h 4.05 3.90 3.75 ee 1 4 e 2 4 l 0.65 0.55 0.45 vw 0.05 y 0 2.5 5 mm scale terminal 1 index area terminal 1 index area b d a e b e 1 e ac b v c w 10 18 e 2 e 19 27 d h 28 36 e h l 1 9 c y c y 1 x c detail x a 1 a 09-02-23 09-02-24
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 16 of 20 nxp semiconductors bgx7221 dual receiver down mixer 15. abbreviations 16. revision history table 8. abbreviations acronym description ac alternating current dc direct current esd electrostatic discharge fcdm field-induced charged-device model hbm human body model if intermediate frequency lo local oscillator mos metal-oxide semiconductor pcb printed-circuit board rf radio frequency table 9. revision history document id release date data sheet status change notice supersedes bgx7221 v.3 20120808 product data sheet - bgx7221 v.2 modifications: ? section 13 : added ? table 4 : updated ? table 7 : updated bgx7221 v.2 20120208 preliminary data sheet - bgx7221 v.1 bgx7221 v.1 20110907 objective data sheet - -
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 17 of 20 nxp semiconductors bgx7221 dual receiver down mixer 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 18 of 20 nxp semiconductors bgx7221 dual receiver down mixer export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
bgx7221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 8 august 2012 19 of 20 nxp semiconductors bgx7221 dual receiver down mixer 19. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . .1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3 table 3. shutdown control . . . . . . . . . . . . . . . . . . . . . . . .4 table 4. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .5 table 5. thermal characteristics . . . . . . . . . . . . . . . . . . .5 table 6. static characteristics . . . . . . . . . . . . . . . . . . . . . 5 table 7. dynamic characteristics . . . . . . . . . . . . . . . . . . 6 table 8. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 9. revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 20. figures fig 1. functional block diagram . . . . . . . . . . . . . . . . . . . .2 fig 2. pinning diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .3 fig 3. application diagram . . . . . . . . . . . . . . . . . . . . . . . .8 fig 4. g conv versus f rf and t mb . . . . . . . . . . . . . . . . . . . .9 fig 5. g conv versus f rf and p i(lo) . . . . . . . . . . . . . . . . . . . .9 fig 6. g conv versus f rf and v cc . . . . . . . . . . . . . . . . . . . .9 fig 7. ip3 i versus f rf and t mb . . . . . . . . . . . . . . . . . . . . .10 fig 8. ip3 i versus f rf and p i(lo) . . . . . . . . . . . . . . . . . . . .10 fig 9. ip3 i versus f rf and v cc . . . . . . . . . . . . . . . . . . . .10 fig 10. nf versus f rf and t mb . . . . . . . . . . . . . . . . . . . . . 11 fig 11. nf versus f rf and p i(lo) . . . . . . . . . . . . . . . . . . . . . 11 fig 12. nf versus f rf and v cc . . . . . . . . . . . . . . . . . . . . . 11 fig 13. icp 1db versus f rf and t mb . . . . . . . . . . . . . . . . . .12 fig 14. icp 1db versus f rf and p i(lo) . . . . . . . . . . . . . . . . . .12 fig 15. icp 1db versus f rf and v cc . . . . . . . . . . . . . . . . . .12 fig 16. 2rf-2lo response versus f rf and t mb . . . . . . . .13 fig 17. 2rf-2lo response versus f rf and p i(lo) . . . . . . . .13 fig 18. 2rf-2lo response versus f rf and v cc . . . . . . . .13 fig 19. a isol versus f rf and t mb . . . . . . . . . . . . . . . . . . . . .14 fig 20. a isol versus f rf and p i(lo) . . . . . . . . . . . . . . . . . . . .14 fig 21. a isol versus f rf and v cc . . . . . . . . . . . . . . . . . . . .14 fig 22. package outline sot1092-2 (hvqfn36) . . . . . .15
nxp semiconductors bgx7221 dual receiver down mixer ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 8 august 2012 document identifier: bgx7221 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 power-up control . . . . . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 thermal characteristics . . . . . . . . . . . . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 application information. . . . . . . . . . . . . . . . . . . 8 13 test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 contact information. . . . . . . . . . . . . . . . . . . . . 18 19 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 20 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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